It defines specific "heel," "toe," and "side" solder fillets based on different density levels (Most, Nominal, or Least material conditions).
The IPC-7352 PDF is a widely used standard in the electronics industry, specifically designed for the design and manufacturing of surface mount technology (SMT) and through-hole technology (THT) components. Published by the Institute for Printed Circuits (IPC), a leading trade association in the electronics industry, this document provides a comprehensive guide for designers, engineers, and manufacturers to ensure the reliability and performance of electronic assemblies. Ipc-7352 Pdf